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    Model H94-30 double-side Mask Aligner

    Update: 2015/2/9      View:
    • Brand:    SVC
    • Type:    H94-30
    • Price:     RMB
    • Promotion:     RMB ( 0 Customers Bought)
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    Introduction

    Main application

    This machine is used to develop and anufacture integrated circuits, semiconductor devices, photoelectronic devices and optical devices. Because of advanced levelling mechanism and small levelling force, this machine is not only applied to expose silicon wafers, glass wafers, and ceramic wafers, but also applied to breakable substrates such as K3As and InP.

    Operation Mode

    Double-side alignment, single-side exposure. Face side of the substrate could not only be aligned but also be exposed. And reverse side of the substrate should be aligned first and then be exposed..

    Main Structure

    It consists of high degree of accuracy aligning worktable, vertical binocular field-spitting microscope, horizontal binocular field-spitting microscope, CCD, computer picture system, multipoint light source (fly's eye) phtotohead, PLC control system, pneumatic system, vacuum system, monoblock vacuum pump, two levels of vibration-resistance worktable, accessories case, etc.. 

    Main Functional Characteristics

    1. Wide ApplicationIt is used to photo-etch all kinds of substrates with diameter below Φ100mm (minimum size is 5×5mm) and thickness below 5mm, including noncircular substrates.2. High ResolutionAdopting multipoint light source (fly's eye) phtotohead of high uniformity, perfect three-point levelling mechanism and stable and reliable vacuum seal device, exposure resolution of the machine is greatly improved. 3. High Accuracy & High Speed of AligningThe aligning mode features with underneath type quintuplicate guideway with stationary mask frame and mobile substrate. The load-bearing platform elevating uses spherical guide, pneumatic Z axis mechanism, and twin reed micro- separation mechanism, which enable the contact and separation between the substrate and mask to have small drift, high accuracy and high speed of aligning, thereby the reusability and rate of the finished products are improved.4. High ReliabilityWith PLC controller, imported electromagnetic valve, button, unique pneumatic system, vacuum pipeline system and parts which are processed by precision machine production technique, this machine has high reliability and it is very simple and convenient to manipulate, maintain and repair.5. Special Function of Processing FragmentsIt solves the problem that mask frame and substrate can’t be aligned because of adhesion between them, which is caused by noncircular substrates, fragments and uneven bottom surface of substrates.

     

    Main Specifications

    ● Sizes of Substrates: 4”、3”、2”,Thickness:≤3mm
    ● Sizes of Mask Frame: 
    □5″×5″、□4″×4″、
    □2.5″×2.5″
    ● Aligning Range: 
    rough adjustment X,Y: 
    ±3mm 
    fine adjustment: ±0.3mm 
    fine adjustment: ±3°
    ● Aligning Accuracy: 
    face side≤1μm , 
    reverse side ≤3μm
    ● Micro-separation: 0-50μm adjustable
    ● Exposure Range: ≥Φ115mm
    ● Exposure Resolution: 1μm
    ● Hard-contact exposure, soft-contact exposure and small-force-contact exposure
    ● Multipoint light source (fly’s eye) phtotohead, Ununiformity of light: ≤±3%, 350-watt Mercury Lamp started by direct current, fan-cooling
    ● Exposure Time: 0-999.9 seconds, adjustable
    ● Luminous Intensity: ≥20mw/cm2, adjustable
    ● Double-side alignment system consists of vertical microscope, horizontal microscope, CCD, computer picture system.
    ● Contact-separation drift: ≤1μ 
    ● Power:
    Compressed Air: 3.5kg
    Voltage: AC220V/50Hz
    Power: 1000W
    ● Overall Dimensions: 870×680×1600 (L×W×H) + computer table sizes
    ● Weight: 180kg.


    Multipoint Light Source(fly's eye)
    Diaphragm with Luminous Iintensity Adjustable

    Place-Fetch Mechanism of Push-Draw Mode


     

    Three-Point Levelling MechanismHigh Degree of Accuracy Regulating Mechanism (X, Y, Z,θ)

     

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